� This job requisition is to seek experienced candidate for the new position of Intel Dalian TD Dry Etch Dielectric Etch Area Manager. In this role, the selected candidate will manage a team of world-class process engineers and etch tools, and report to the DTD Dry Etch Director. The job responsibilities include leading world-class 3D NAND etch development (such as high aspect ratio gate pillar, contact, and isolation), co-owning the technology transfer and synergy with DMTM HVM counterpart, and collaborating with US Pathfinding team for equipment and process development.
� An expatriate assignment of up to 2 years might be required for qualified internal candidate.

Qualifications

� The candidate must have demonstrated a track record of leadership and technical excellence in creative problem solving, equipment or device development, or manufacturing process optimization in dry etch area.
� Technical Qualifications
� MS or PhD in a science or engineering field and minimum 10 years of experience in semiconductor R&D environment are required;
� Broad and deep knowledge of plasma dry etch chambers & processes is required;
� Hands-on experiences in technology development and technology transfer are highly desired;
� Other Qualifications
� Motivated self-starter, with strong ability to work independently as well as in a team environment;
� Strong verbal and written communication skills in English;
� Prior team lead experience and achievements are highly desired.

Non-Volatile Solutions Memory Group:  The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices.  The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.