Job Description
Responsibilities include, but are not limited to:
Lead factory defect baseline performance improvement and excursion prevention
Collaborating with PE, PI, YE, QE to address yield and reliability issues
Balancing risk and speed of learning for SWRs and conversions and communicating process performance metrics
Partnering with production and industrial engineering to optimize area processes
Presenting leadership on all process-related issues impacting Production and Yield
Ensuring change management is communicated and conducted efficiently with proper watching plan
Collaborating with transfer site to drive process alignment and leverage best known methods
Managing root cause analysis and creating plans for scrap and excursion abatement
Managing projects to ensure deliverables are completed within the required timeframe

Qualifications

Candidates must possess a MS or Ph.D. in Electrical Engineering, Materials Science, Physics, Chemistry or Chemical Engineering. Additional qualifications include:
Minimum 5 years of direct experiences in defect reduction, process engineering, integration and yield analysis organizations is required.
Direct experience in 3D NAND technology development, transfer, ramping and sustaining are preferred.
Understand defect metrology tool work principle, capability, inline detection challenge and have thoughts on opportunities.
A proven history of technical problem solving through the creation of solutions that demonstrated creativity and out-of-box thinking.
Excellent data extraction and analysis skills, and well versed in DOE principles.
Ability to multi-task and be effective in providing timely solutions.
Strong organizational and communication skills to manage tasks across Process Engineering areas to effectively execute and commit to deliverables.

Inside this Business Group

Non-Volatile Solutions Memory Group:  The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices.  The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.