Job title: CMP Module Process Technical Manager
Grade: 7-8

Dalian is home to DMTM(Dalian Memory Technology and Manufacturing), Intel's first memory fabrication site. DMTM is a state of the art memory maker and manufacturer, its 3D NAND Chip was born to shake up the market with its low cost and higher performance technology. As Memory and storage are key drivers of growth for Intel, the work being done at DMTM is critical to our long-term vision for success. For every piece of memory we sell, we build further inroads to other Intel key growth areas-IoT, data center, and CPU opportunities. Memory is a part of the foundation of technology that powers the smart, connected world we hope to bring to everyone.
Intel Dalian is rapidly expanding its 3D NAND high volume manufacturing facility, And now we are seeking for many strong candidates to join TFP department to focus on process development and continuous improvement in CMP area.
Job responsibility:
Responsibilities include, but are not limited to:
� Problem solve, develop and optimize the CMP process to improvement yield, reliability of silicon while to drive cost down continuously
� Responsible for production support with respect to technology development, maintenance specifications, manufacturing etc
� Responsible for optimizing process flow related to cost constraints
� Partner with other engineering, manufacturing groups to develop and ensure successful product qualifications;
� Develop wafer/die level inline measurement capabilities for quicker data turn around, and real time feedback and drive for process improvement;
� Lead cross functional teams to solve critical technical problems through various phase of process development, product development, manufacturing and ramp up.

Qualifications

Qualification (Knowledge and skills required)
� Minimum 5 years of direct experiences in CMP process/equipment on AMAT/Ebara platform.
� Good data mining skills on CMP related;
� Deep understanding of Logic/NAND product, process related to CMP;
� Good understanding of factory fabrication operations and semiconductor process flow. Experience in transfer, start up, and ramp of a high volume 300mm wafer fab.
� Strong stakeholder management capability, both internal and external, to drive aggressive roadmaps.
- Demonstrated passion towards innovation and risk-taking in order to achieve excellence.
- Result oriented mindset and demonstrated leadership capability: setting high expectations, driving accountability to those expectations, role modeling the desired culture, team development, decision making and prioritization skills.
� This position is located in Dalian, China. Fluent English and Chinese skills are required.
Education (Desired degree & major)
� Must possess a MS or Ph.D. in Electrical Engineering, Materials Science, Physics, Mechanical engineering, Chemistry or Chemical Engineering

Non-Volatile Solutions Memory Group:  The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices.  The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.