后段封装专家
中芯国际集成电路制造有限公司ShanghaiUpdate time: May 16,2019
Job Description
岗位职责:
任职资格:
Full ownership of CPI related topics for all SMIC FinFET products, including
- CPI test and qualification vehicle specification and design overview. Definition of CPI test structures, both on Silicon and in the package.
- Support to BEOL Integration & Reliability Engineering teams to build full and partial flow wafers through fab and post-fab operations.
- Interfacing with internal and external (OSAT) engineering teams to enable overall development and qualification efforts (i.e. process window experiments utilizing DoEs, wafer probe/test, reliability testing).
- Definition and maintenance of CPI related design rules in all relevant Design Manuals.
- Review and approval of all fab & OSAT process changes relevant to CPI.
- Close collaboration and alignment with SMIC extended CPI teams across all BUs.
- Support of the Customer Engineering and Field Engineering Teams with any CPI related activities.
- Effectively communicate project results and updates to key stakeholders, both internal and external to SMIC.
任职资格:
- 5 yrs package (Bumping & Assembly) process integration (NPI or RND or TPM or PE) experience with very good leadership for new production phase in and qualification
- Experience of advance fab tech. and package type (Flip chip, Fan-out, SIP, PoP etc.)
- Deep study of CPI (chip package interaction) related process modules (bumping, back grinding, laser groove, flip chip attached, reflow profile, under-fill, molding etc.)
- Deep study of package design total solutions (package structure design, process design, package material selection, mechanical/electrical/thermos-analysis simulation etc. ) for CPI risk mitigation.
- Good project management skill (milestone definition, coordination of cross function team, troubleshooting, execution following up, report summary/presentation skill etc.)
职能类别： 其他
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上班地址：张江路18号
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