高级半导体封装技术员(2018/2019本科应届毕业生)
菲尼萨光电通讯有限公司ShanghaiUpdate time: June 18,2019
Job Description

Title:高级半导体封装技术员

工作职责:

  • Support engineer to develop OSA process and new platform in SHG prototype line
  • Support engineer transfer SHG OSA process to manufacturing site Wuxi (China) or Ipoh (Malaysia) for mass production
  • Process data collection, analysis and FA for process yield and HPU improvement
  • Station debug on floor and implement process/platform improvement actions to product line SBR build and DOE support
  • Write production document (working instruction, training material /IWO/ SOP/……)
  • Coach & certificate operator.

任职条件:

  • Junior College or above
  • New Bachelor graduator or have at least 2 year relative industry process work experience.
  • Optimism and good communication skill
  • Willing to travel oversea will be a promoted plus.
  • Software: Office and outlook
  • Good writing or oral English will be a promoted plus.
  • NCG: Major in Optics, Physics or related engineering discipline;
  • Have active aligner process (Fiber alignment or laser welding or lens alignment or active placement of micros optics) experience

职能类别: 设备主管 工艺工程师

关键字: 贴片,焊线

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联系方式

上班地址:汇庆路66号

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