高级半导体封装技术员(2018/2019本科应届毕业生)
菲尼萨光电通讯有限公司ShanghaiUpdate time: June 18,2019
Job Description
Title:高级半导体封装技术员
工作职责:
- Support engineer to develop OSA process and new platform in SHG prototype line
- Support engineer transfer SHG OSA process to manufacturing site Wuxi (China) or Ipoh (Malaysia) for mass production
- Process data collection, analysis and FA for process yield and HPU improvement
- Station debug on floor and implement process/platform improvement actions to product line SBR build and DOE support
- Write production document (working instruction, training material /IWO/ SOP/……)
- Coach & certificate operator.
任职条件:
- Junior College or above
- New Bachelor graduator or have at least 2 year relative industry process work experience.
- Optimism and good communication skill
- Willing to travel oversea will be a promoted plus.
- Software: Office and outlook
- Good writing or oral English will be a promoted plus.
- NCG: Major in Optics, Physics or related engineering discipline;
- Have active aligner process (Fiber alignment or laser welding or lens alignment or active placement of micros optics) experience
职能类别: 设备主管 工艺工程师
关键字: 贴片,焊线
微信分享
联系方式
上班地址:汇庆路66号
Get email alerts for the latest"高级半导体封装技术员(2018/2019本科应届毕业生) jobs in Shanghai"
