PRINCIPLE DUTIES AND RESPONSIBILITIES 主要工作职责：

1.Host iTG (intelligence Toll Gate) MADS (Mitigation Action Disposition Samples) forum when there’s schedule conflict between new BiCS wafer node or Technology Program and new Product, and follow up the actions till closure;
2.Accountable on PNtF (Prove Not to Fail) forum for new BiCS node, Technology Program and new platform, till all PNtF items are regressed;
3.Accountable on managing and sustaining CFMEA RPN# below 100 for defect modes during new BiCS Node and Technology Program development, drive for improvement actions if necessary;
4.Accountable on investigation for new BiCS node and Technology Program or new platform low yield lots, come out investigation report;
5.Accountable on Metrology Instruction establishment during new BiCS node or Technology program and Platform development;
6.Accountable on DIPAC(Device Interact with Package Assembly Charz) program, to find out testing soft bin indicator for packaging assembly and the assembly factors impacted device performance, control it;
7.Accountable on component (Apple/Memory components/iNAND packages) and advanced packaging (Flip chip/TSV/POP, etc) competitive analysis and benchmarking;
8.Facilitate RCA(Root Cause Analysis) meeting till root cause identified;
9.Responsible product ePPM as well as new Technology and new BiCS node;
10.Accountable on digging out failure mechanism till proven (applicable for PHD);
1.新晶圆或新技术项目的开发计划跟新产品开发计划冲突时，负责主持召开MADS的会议，记录并跟踪会议要点；
2.负责主持召开新晶圆, 新技术项目和新平台的PNtF会议，记录并跟踪会议要点；
3.使用FMEA – 风险管理工具， 管理新晶圆, 新技术项目和新平台开发过程中的风险；
4.负责新晶圆, 新技术项目和新平台开发过程中的低良率工程批的调查报告；
5.负责新晶圆, 新技术项目和新平台开发过程中的工艺品质关键点的新的测量方法的建立；
6.负责研究芯片制造工艺和封装工艺的互耦，并从测试的soft bin中找出封装失效的指标；
7.负责对标业界的封装技术；
8.主持RCA，记录并跟踪会议要点；
9.使用Scorecard – 风险管理工具, 负责管理产品的ePPM；
10.负责研究失效机理 (适用于博士)。

REQUIREMENTS 职位要求：

1.Bachelor/Master/PhD Degree major in Engineering Mechanics, Mechanical Engineering, Material Science, Polymer Science, or other engineering subjects;
2.Good English communication (written and verbal) and interpersonal skills;
3.Self-motivated and self-directed;
4.Hard working, and be able to work under high pressure;
5.Ability to troubleshoot and analyze complex problems;
6.Ability to multi-task and meet deadlines, take full ownership.

1.电子/工程/材料相关专业，硕士/博士学历；
2.良好的书面英语和口语能力；
3.自我激励和自我导向，同时具备出色的与他人协作完成工作的能力；
4.具备压力下工作的素质；
5.具备排查和分析复杂问题的能力；
6.具备多任务能力和按时交付的能力。