PRINCIPLE DUTIES AND RESPONSIBILITIES 主要工作职责：

1. New Product Sample Development Execution for 3D NAND packaging & assembly product qualification;
2.Assembly in-line Process trouble-shooting for new product sample builds.
3.DOE Experiment and data processing for new process & product design and development.
4.Assembly yield improvement for new products.
1.新产品样品开发和制备；
2.新产品封装制程开发的工艺异常处理；
3.工艺实验操作和数据处理；
4.新产品工艺良率改善

REQUIREMENTS 职位要求：

1. Education
Bachelor Degree in Semiconductor, Material, engineering, Mechanics
2.Knowledge
Have basic knowledge of Material science and its mechanical and thermal characterization
3.Capable of Experiment Design and Statistical Analysis
4.Competencies & Soft Skill
Good communication/team work/planning skills.
Good Computer & Microsoft Office skills are required,
Be capable of occasionally over-time and shift work.
5.Good English communication and interpersonal skills
1.半导体/材料/工程/机械类专业本科
2.具有材料特性分析和机械，热应力方面的基础知识
3.具有实验试验和基础数据统计分析的能力
4.良好的交流、团队合作和规划能力
5.良好的办公软件使用能力
6.需要一定的加班和翻班
7.良好的英文读写能力