PRINCIPLE DUTIES AND RESPONSIBILITIES 主要工作职责：

1.Develop flip chip technologies, bring it up from R&D phase to mass production mature level;
2.Generate new recipe and perform process optimization for FC process;
3.Perform FC buyoff and qualification for new products;
4.Review new package process flow and design drawing, maintain design rule and process control documents;
5.Conduct engineering DOEs and apply statistical analysis method to solve problems, make decision with data;
6.Master SPC control chart method to control process variation

1.把倒装芯片相关技术从研发阶段导入量产水平；
2.对于倒装芯片工艺制定新程序并进行改善；
3.审阅新产品的工艺流程和设计图纸，维护设计方针和工艺控制文件；
4.实施工程DOEs以及运用统计分析方法来解决问题和执行决定；
5.掌握SPC 控制方法来控制工艺的变化。

REQUIREMENTS 职位要求：

1.Master degree in microelectronic science and technology or in material science and technology；
2.English communication skills: CET-6, be fluent both in oral and written English；
3.Basic understanding of assembly process flow & materials property；
4.Basic knowledge of operation principle for flip chip related technology；
5.Basic Computer & Microsoft Office skills are required, AutoCAD/Cadence/JMP are preferred；
6.Be capable of analyzing SEM/FIB/TEM/EDX results, operating is preferred；
7.Good communication/team work/planning skills.

1.电子工程/材料相关专业，硕士学历；
2.英语交际能力：CET-6 ，流利的说和写；
3.理解基本的封装工艺流程和材料特性；
4.掌握基本的倒装芯片的知识；
5.掌握基本的Microsoft Office skills，有AutoCAD/Cadence/JMP能力的更好；
6.具备SEM/FIB/TEM/EDX分析和操作能力的更好；
7.良好的沟通能力和人际交往技巧。