At Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you thought was once impossible, possible.

At our core, Western Digital is a company of problem solvers. People achieve extraordinary things given the right technology. For decades, we’ve been doing just that. Our technology helped people put a man on the moon.

We are a key partner to some of the largest and highest growth organizations in the world. From energizing the most competitive gaming platforms, to enabling systems to make cities safer and cars smarter and more connected, to powering the data centers behind many of the world’s biggest companies and public cloud, Western Digital is fueling a brighter, smarter future.

Binge-watch any shows, use social media or shop online lately? You’ll find Western Digital supporting the storage infrastructure behind many of these platforms. And, that flash memory card that captures and preserves your most precious moments? That’s us, too.

We offer an expansive portfolio of technologies, storage devices and platforms for business and consumers alike. Our data-centric solutions are comprised of the Western Digital®, G-Technology™, SanDisk® and WD® brands.

Today’s exceptional challenges require your unique skills. It’s You & Western Digital. Together, we’re the next BIG thing in data.

You will work as intern role in Assembly PIE (packaging integration engineering) Team. Major focus on IT program projects and also support PIE team on new product development activity.

These IT projects are to improve overall work efficiency during new product development. Target projects listed as below:

• Engineering product tracking system enhancement. 
• Auto process flow system.
• Error proof function for process flow setup.
• Explore other new data automation opportunities. 

During support PIE on new product Package development, performance monitor and system maintenance will be key focus:

• Work closely with both internal teams and cooperate team on product yield tracking and drive for yield improvement.
• Setup new product assembly process flow and manage new product BOM.
• Lead new packaging technology transition (new wafer tech/process/material) from engineering stage up to volume production.

• Bachelor or Master Students major in Computer Science, Material Science, Mechanical Engineering or other engineering areas
• Interested on Packaging engineering R&D and data analysis
• Prefer to have some experience on one programming language such as Python, Java, C+, Swift etc
• Work at least 3 days per week

Western Digital thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.

Western Digital is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at [email protected] to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.