• Microelectronic Packaging Engineers provide project management, package development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units.
• Responsible for early engagement with NPI development to ensure robust package quality, reliability and manufacturability.
• Flawless execution on product ramp and HVM sustaining activities including yield improvement, change control, excursion management and value engineering projects.

Qualifications

Minimum Qualifications:

• Possess a master's degree in Mechanical Engineering or Material Science Engineering or Chemical Engineering or related field of packaging process and development.
• 6 to 10 years of industry experience with strong familiarity with various packaging process and technology for Flip Chip CSP and Flip Chip BGA. Experience in advanced packaging 2.3D/2.5D/3D technology is added advantage.
• Solid knowledge of substrate, bumping, packaging technologies, assembly process, packaging materials, reliability standards and failure analysis.
• Experience/background working with OSATs/supplier worldwide is an added advantage.
• Strong analytical and problem solving skills.
   

Preferred Qualifications:

• Team player and facilitator. Works collaboratively with other teams and role models collaboration.
• Influencer. Self-aware, active listener, and seeker of win-win solutions. Seeks to influence key thought leaders and deciders.
• Communicator. Communicates clearly - visual, written, and verbal - across all levels at Intel. Values brevity and getting to the point.
• Assertive. Works independently, develops a point of view, and advocates across Intel. Respect people and process while advocating.
• Curiosity. Learns fast, derives trends from data, and drives solutions. Asks the great thought-provoking questions that drive action.
• Passion. Person who enjoys Product Integration Engineering, Leadership and has an established track record of achieving excellent results through their team.

Intel's Sales and Marketing (SMG) organization works with global customers and partners to solve critical business problems with Intel based technology solutions. SMG works across business units to amplify the customer voice and deliver solutions that accelerate their business. We work across numerous industries, including retail, enterprise and government, cloud services and healthcare as examples. The operations team focuses on forecasting, driving alignment with factory production and delivering efficiency tools and our marketing capability drives demand and localized marketing in locations around the globe. Our sales force navigates a complex partner and customer ecosystem while shaping product roadmaps, driving value for our customers, and collaborating to harness emerging technology trends to deliver comprehensive solutions.