Western Digital Corporation is the world’s largest data storage company with a leading portfolio of HGST, SanDisk, G-Technology and WD brands covering flash and disk-based solutions. Deployed by the largest and most prominent organizations worldwide, Western Digital solutions are everywhere, touching lives and enabling great value from the data they possess.

QUALIFICATIONS REQUIRED:

•       Bachelor’s/Master’s degree in Material, Electric, Semiconductor, Mechanical, Chemical, etc.

•       Have >=2 years new product introduction or process engineer experience on one of wire bonding process is preferred.

•       Basic understanding of Semiconductor assembly process flow & materials property.

•       Good English communication (written and verbal) skills.

•       Self-motivated, hardworking, teamwork.

ESSENTIAL DUTIES AND RESPONSIBILITIES:
 

·       Process development on Die Preparation, Die attach, Wire Bonding process on DIC, CLGA Package.

·       Material prepares and scrap, samples shipment for AI build on time delivery

·       Basic data analysis with statistical analysis tools, example: JMP

All your information will be kept confidential according to EEO guidelines.