• Microelectronic Packaging Engineers provide project management, package development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units.
• Responsible for early engagement with NPI development to ensure robust package quality, reliability and manufacturability.
• Flawless execution on product ramp and HVM sustaining activities including yield improvement, change control, excursion management and value engineering projects.

Qualifications

• Possess a master's degree in Mechanical Engineering or Material Science Engineering or Chemical Engineering or related field of substrate manufacturing process and development.
• 5 to 10 years of industry experience with high density interconnect substrate design rule/Spec, roadmap, material properties and manufacturing process for different substrate technologies included FCBGA, FCCSP, Coreless and ETS substrate.
• Familiar with substrate layout tool (Allegro PCB Design) and able to work with substrate designer in BU/OSAT for substrate drawing review and address the gaps in VDA.
• Able to perform substrate TRA whenever a HVM changes requested or alternative substrate supplier qualification.
• Good understanding of substrate/package design, assembly process flow for a broad range of packaging technologies (FCCSP, FCBGA) including typical bill of materials (BOM).
• Experience/background working with OSATs/ Customer worldwide is an added advantage.
• Excellent data extraction, analysis and problem solving skills. (system data mining, JMP...etc)
• Excellent written and verbal communication skills in English.

Inside this Business Group

Intel's Sales and Marketing (SMG) organization works with global customers and partners to solve critical business problems with Intel based technology solutions. SMG works across business units to amplify the customer voice and deliver solutions that accelerate their business. We work across numerous industries, including retail, enterprise and government, cloud services and healthcare as examples. The operations team focuses on forecasting, driving alignment with factory production and delivering efficiency tools and our marketing capability drives demand and localized marketing in locations around the globe. Our sales force navigates a complex partner and customer ecosystem while shaping product roadmaps, driving value for our customers, and collaborating to harness emerging technology trends to deliver comprehensive solutions.

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site.