About the team:
The position is within Design Enablement PROM Circuit Technology team, which delivers critical technology optimized PROM(Programmable Read Only Memory) – a type of non-volatile memory circuits in advanced CMOS technologies. We are focused on developing non-volatile designs on leading edge Si technologies and looking to exploit various device and technology options to create non-volatile designs that can serve various market segments of Intel products.
 

About the role:
As a Memory Hardware Circuit Integration and Structural Design Engineer, you'll be responsible for but not limited to the following:

The selected candidate is expected to work closely with process integration and device engineers to engage in state-of-the-art full custom non-volatile array design along with peripheral circuits such as power gates, charge pump, low-dropout regulator (LDO), and digital and analog control circuitry.

The position involves working with layout engineers and layout planning down to the leaf cell level.

Design ownership usually involves all aspect of design planning and implementation including schematics, layout planning, SPICE level and logic simulation/validation..

The candidate is also expected to contribute to post-Si activities such as design debug and yield analysis to be able to root cause both design or Si process problems that may be preventing the design from achieving the required specs and yield.

Qualifications

Minimum Qualifications:

• Master's in Electrical and Computer Engineering (ECE), Electrical Engineering (EE) or related field with 2+ years of professional experience in the areas listed below, or

• PhD Electrical and Computer Engineering (ECE), Electrical Engineering (EE) or related field with 0-6 mnths of professional experience in the areas listed below

Minimum experience required in the following areas:

• Circuit design

• Semiconductor devices physics

Preferred:

• ​Including non-volatile memory, SRAM, or other memory

• Analog and mixed signal circuits

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Work Model for this Role

This role will require an on-site presence.