Intel's recently announced IDM 2.0 strategy includes a plan to significantly expand the manufacturing network, establishing new capacity and capability to meet the accelerating global demand for semiconductors. The Disaggregated Manufacturing Organization (DMO) will play an important role in this strategy, leveraging Intel's Advanced Packaging technology portfolio to deliver leadership products. To enable this ramp, DMO is building an Advanced Packaging manufacturing facility in Malaysia, increasing its investment in this region which has been a critical part of Intel's supply chain for nearly five decades.

This position is an Expat assignment and requires relocation to Penang Malaysia.

Join the Intel Malaysia Advanced Packaging team where you will be instrumental in developing and ramping some of Intel's newest Advanced Packaging technologies and help us realize Intel's vision to create and extend computing technology to connect and enrich the lives of every person on Earth. Disaggregation Manufacturing Organization (DMO) is responsible for enabling and ramping modular manufacturing, which is a critical capability for Intel's leadership products. The project will include 2 types of factories: Advanced Packaging and Bump/Interposer. The Bump/Interposer factory includes the following activities: Passive Interposer (PI), TSV patterning and TSV reveal (TSV- through Si Via) and C4.This area will focus on cross module systems that includes wafer handling systems. The position will be reporting to Wafer Level Assembly Department Manager.

The candidate will be responsible for but not limited to:

• New technology process transfer and matching to ensure successful startup and ramp to high volume manufacturing (HVM).
• Must build a proficient engineering department to run process control and tool maintenance activity.
• Demonstrate leadership skills to enable the organization to meet expectations around safety, quality, output, and affordability.
• The manager must have sufficient technical knowledge to provide clear management direction for daily operations/maintenance, process engineering prioritization, yield improvement and manufacturing efficiency improvement.
• As a member of the factory staff, will also be responsible for influencing efforts toward improving overall organizational culture and operation effectiveness.
• The candidate will also be responsible for people and leadership development to grow the organizational capability and must have a proven track record in managing people and the willingness to build a compelling vision and mission for the organization and get the direct leaders and employees aligned to this direction.

The candidate should exhibit the following behavioral traits:

• To be a self-starter, highly organized, and willingness to work independently across organizations.
• Has a proven track record as a strong leader with high technical and analytical skills.
• Has strong knowledge in structured problem-solving methods, a good understanding of statistical data analysis and techniques, planning and prioritization, influencing others, and strong communication skills.
• Is a team player with a high level of synergy w/ virtual factory peers, stakeholders and customers
• Is proficient in the fundamentals of factory operations, process/materials/equipment interaction, change control, pcs, and quality systems.
• Skills in leading and developing individuals, managers, and teams.
• Skills to provide technical and tactical direction.

Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Qualifications listed as preferred or additional will be considered a plus factor for applicants.

Minimum Requirements:

• Candidate must possess a Bachelor's or Master's degree in Electrical Engineering, Chemical Engineering, Mechanical Engineering, Materials Science, Physics, Optics, Chemistry, or related field of study.
• 8+ years of experience in manufacturing or engineering environment.
• 8+ years of experience in direct managing of a team of 10+
• 3+ years of experience in wafer handling systems, sorters

This position is not eligible for Intel immigration sponsorship.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

Other Locations

US, Arizona, Phoenix;US, California, Folsom;US, California, Santa Clara;US, New Mexico, Albuquerque

Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Work Model for this Role

This role will require an on-site presence.