Signal integrity engineer in Assembly and Test Technology Development organization to drive high speed IO and signal integrity related methodology and tool development. Defines overall electrical performance specification and realizes technology certification through extensive design, analysis and validation activities. Conducts and supports research through internal and external programs on fundamental areas pertinent to circuits, packages, and interconnects. Collaborates with other engineers in the team and helps establish a team atmosphere promoting growth of core competency areas.

You will be responsible for the following:

• Designs, develops, modifies and evaluates complex analog and mixed signal electronic parts, components or integrated circuitry for analog and mixed signal electronic equipment and other hardware systems.
• Determines creative design approaches and parameters.
• Analyzes equipment to establish operating data.
• Conducts experimental tests and evaluates results.
• Applies and uses independent evaluation to selects components and equipment based on analysis of specifications and reliability.
• Evaluates practical capability of vendor to support product development.
• Also includes Analog, MixedSignal and RF Development Engineers with specialized skills and expertise in developing Monolithic Integrated Circuits for wireless and wireline communications systems and products using CMOS, BiCMOS, SiGe, GaAs Process technologies.

This is an entry level position and compensation will be given accordingly.

Qualifications

You must possess the below minimum qualifications to be initially considered for this position.

Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates.

Experience listed below would be obtained through a combination of your schoolwork and/or classes and/or research and/or relevant previous job and/or internship experiences.

Minimum Qualifications:

• M.S. in Electrical and Computer Engineering with a focus on applied electromagnetics, power/signal integrity, packaging or a related area.
• Demonstrate experience on the following:
• Packaging, interconnects, applied electromagnetics and high speed IO design.
• Circuit analysis and signal and power integrity tools such as Simulation Program with Integrated Circuit Emphasis-SPICE, High Frequency Simulation System-HFSS and Advanced Design System-ADS.
• Computer architecture and fundamental scripting skills with tool such as Matlab.
• Proficiency of transmission line fundamentals, microwave engineering and electromagnetics
• Candidate must possess the degree by employment start date. 

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site.