• Work within assembly house engineering team providing leadership in the areas of package assembly to meet design and reliability intend.
• Build net-list for assembly house to complete laminate layout.
• Review BOM/BD/POD/Laser Marking documents.
• Review Assembly House process and control documents.
• Engage in process improvements. Support customer audits. Support production to ensure yield targets are met. Troubleshoots issues as they arise.
• Work with internal NPI teams, release WO for engineering runs, update assembly documents as necessary.

Job Qualifications

• MS in Mechanical Engineering, Materials Science, Physics or similar disciplines.

• Experience in WLCSP, QFN, LGA and flip chip packages

• Very good knowledge of assembly processes, such as wafer grinding, dicing, die attach, die stacking with thin die, flip chip, wirebond, encapsulation, underfill, molding, ball attach, singulation.

• Direct hands on experience on the package assembly line

• Capability of addressing chip/package interaction stress issue.

• Expert in problem solving/trouble shooting and providing a solution. Knowledge of DFMEA and PFMEA

• Knowledge of statistics

• Knowledge of MEMS packaging (e.g. pressure sensor, fingerprint sensor, accelerometer, microphone).