Description

At Xilinx, we are leading the industry transformation to build an adaptable, intelligent world. ARE YOU bold, collaborative, and creative? At Xilinx, we hire and develop leaders and innovators who want to revolutionize the world of technology. We believe that by embracing diverse ideas, pushing boundaries, and working together as ONEXILINX, anything is possible.

Our culture of innovation began with the invention of the Field Programmable Gate Array (FPGA), and with the 2018 introduction of our Adaptive Compute Acceleration Platform (ACAP), has made a quantum leap in capability, solidifying our role as the adaptable platform supplier of choice. From the start, we have always believed in providing inventors with products and platforms that are infinitely adaptable. From self-driving cars, to world-record genome processing, to AI and big data, to the world’s first 5G networks, we empower the world’s builders and visionaries whose ideas solve every day problems and enhance people’s lives.

If you are PASSIONATE, ADAPTABLE, and INNOVATIVE, Xilinx is the right place for you! At Xilinx we care deeply about creating meaningful development experiences while building a strong sense of belonging and connection. We foster an environment of empowered learning, wellness, community engagement, and recognition, so you can focus on work that matters – world class technology that improves the way we live and work. We are ONEXILINX.

• Works collaboratively with suppliers to verify changes to design rules, manufacturing processes and materials do not impact quality and reliability
• Works collaboratively with supplier and/or internal teams to execute reliability evaluation tests and pre-quals to ensure 1st trials pass qualification
• Ability to execute activities in MRB process
• Analyzes data and publishes data in standardized format, raises flags on out of control items

• Works collaboratively with suppliers to collect the necessary data in a standardized format
• Works collaboratively with suppliers to update MFC, CPD, FMEA and MSC for all assembly & substrate approved suppliers

• Executes different value engineering projects
• Manages agreed upon meetings with suppliers and develops appropriate agendas
• Effectively communicates with suppliers on tracking issues; publishes meeting minutes and captures open actions after meetings
• Works collaboratively with suppliers to understand impact of PCN on Xilinx devices
• Participates in discussions with suppliers to gain alignment on Xilinx's goals (yield, quality and reliability)

• Maintains a working knowledge of specific interconnect domains
• Works collaboratively with suppliers to verify changes to design rules, manufacturing processes and materials does not negatively impact yields
• Collects and stores yield, quality metrics and indices data in agreed upon frequency and database; analyzes data and publishes data in standardized format
• Raises flags on low yield and/or out of control lots
• Executes continuous improvement activities and documents results appropriately

• B.S or M.S degree in mechanical engineering, physics, materials science or similar disciplines with minimum of 2 years of experience in the ramp to high volume manufacturing of flip chip packages is required.

• Direct experience in IC package manufacturing, technical project management, and working first-hand with semiconductor assembly and material suppliers for FCBGA.
• Proven track record to bring a product/package from conceptual stage to development and to HVM environment. Ability to construct Designs of Experiments and down-select materials and processes.
• Good written and verbal communication skills. Able to present ideas, design concepts, data and plan with high confidence at team meetings and executive review meetings.
• Proficiency in statistical data analysis.
• Ability to work independently and take on projects with minimum supervision.
• Positive thinking / attitude , excellent teamwork.