封装工艺工程师实习生/Assembly Process Engineer Intern
Texas InstrumentsChengduUpdate time: June 13,2019
Job Description
封装工艺工程师实习生/Assembly Process Engineer Intern
- (190000OL)
About TI
Texas Instruments Incorporated (TI) is a global semiconductor design and manufacturing company that develops analog ICs and embedded processors. By employing the world’s brightest minds, TI creates innovations that shape the future of technology. TI is helping about 100,000 customers transform the future, today. We’re committed to building a better future – from the responsible manufacturing of our semiconductors, to caring for our employees, to giving back inside our communities and developing great minds. Put your talent to work with us – change the world, love your job!
About the job
Describe responsibilities
Texas Instruments Incorporated (TI) is a global semiconductor design and manufacturing company that develops analog ICs and embedded processors. By employing the world’s brightest minds, TI creates innovations that shape the future of technology. TI is helping about 100,000 customers transform the future, today. We’re committed to building a better future – from the responsible manufacturing of our semiconductors, to caring for our employees, to giving back inside our communities and developing great minds. Put your talent to work with us – change the world, love your job!
About the job
Describe responsibilities
职位描述：
负责各种封装形式的电子组件操作；
根据芯片准备，芯片粘贴及焊线的流程进行操作；
根据设计要求进行调试；
协助主管评估、收集数据并分析，引导相应工艺丢失的良率与质量提高；
与工程团队一起找到问题的根本原因，并提出改善行动。
我们在寻找:
理工科专业，2020届毕业生；
良好的英语听说能力；
有独立思考能力，团队合作精神。良好的问题分析、解决能力；
熟练操作MS-office软件。
Primary Location CN-CN-Chengdu
Work Locations Chengdu > China, Chengdu AT No.8-8 Kexin Road, High-tech Zone(West) Chengdu 611731
Job Manufacturing
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Temporary
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Job Posting Jun 4, 2019, 2:02:42 AM
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