TD Analytics and Technology Automation (TD ATA) is hiring a Automation Program Lead for critical initiatives to enable advanced packaging technologies in partnership with Assembly and Test Technology Development (ATTD) and Disaggregation Mfg customers. In this role you will have the opportunity to drive new / innovative fundamental improvements in automation capabilities to enable critical packaging technologies, manufacturing efficiency, tool availability, output, cycle time, and labor productivity, in pursuit of advance packaging technology and manufacturing leadership for Intel. You are an ideal candidate for this position if you are a technical leader who enjoys working in fast paced, data-driven, and results-oriented engineering environment, you have the ability to lead people effectively in a collaborative matrixed organization, and you have a strong desire for learning, adapting, and driving change.

Responsibilities include, but not limited to:

• Lead and manage large scale, cross-organizational automation programs from exploration through deployment, including systems integration, customer roadmaps, integrated test, and HVM transfer.
• Establish proactive, strategic engagements with key partners and customers to define, align and execute to roadmaps. Align with ATTD and TD ATA senior management on automation capability roadmaps and priorities, translating business and functional requirements into concrete deliverables.
• Present a one-stop, seamless face of TD ATA to ATTD, DMO, and ATM partners for new capability development and delivery, managing schedules and budgets.
• Bridge the interfaces between ATTD, DMO partners and TD ATA Centers of Excellence and deliver customer capabilities in a highly matrixed environment.
• Explore emerging business disruptions and ideas in the industry and identifying opportunities to influence and intercept internal product roadmaps with specific product and/or feature responses.
• Conduct critical analyses to identify automation opportunities to drive process improvement and efficiency for the factories (yield, output, velocity, cost, labor savings, etc.)
• Conduct cost, schedule, and feasibility analysis for the approval of funding and resources to develop automation solutions.

The candidate should also exhibit the following behavioral traits and/or skills:

• Business acumen on package and test processes.
• Track record of delivering major automation programs with broad scope, high levels of complexity, cross functional team engagement, and challenging deliverables.
• Passionate and values hands-on, in-person, and factory engagement with customers, partners, and end-users to understand process, systems, and gaps faced by customers.
• Strongly collaborating to close gaps and bring new / effective auto capability.
• Ability to influence and shape outcomes with senior executive level stakeholders.
• Understanding of the relevant automation technology and industry trends.
• Communication skills to articulate complex technical and business issues and solutions to varied audiences of technical experts and managers at multiple levels.

Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

• BS, MS, or PhD in Computer Science, Computer Systems Engineering, or Engineering related discipline.
• 10+ years of experience working with semiconductor factory automation factory systems such as Equipment Automation (SEMI SECS/GEM), Yield, PCS Systems, Manufacturing Execution System (MES), Manufacturing Kitting Control Systems, Process Control Systems (PCS), NPI Systems, equipment automation, and/or engineering analysis tools.
• Minimum of 3 years of program or large-scale project management experience.

Preferred Qualifications:

• Experience with implementation of Automated Material Handling systems
• Experience with implementation of Industry 4.0 capabilities

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

Other Locations

US, Arizona, Phoenix

Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site.