China – Packaging Engineering (T)
Western DigitalShanghaiUpdate time: July 14,2021
Job Description

公司介绍

At Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you thought was once impossible, possible.

At our core, Western Digital is a company of problem solvers. People achieve extraordinary things given the right technology. For decades, we’ve been doing just that. Our technology helped people put a man on the moon.

We are a key partner to some of the largest and highest growth organizations in the world. From energizing the most competitive gaming platforms, to enabling systems to make cities safer and cars smarter and more connected, to powering the data centers behind many of the world’s biggest companies and public cloud, Western Digital is fueling a brighter, smarter future.

Binge-watch any shows, use social media or shop online lately? You’ll find Western Digital supporting the storage infrastructure behind many of these platforms. And, that flash memory card that captures and preserves your most precious moments? That’s us, too.

We offer an expansive portfolio of technologies, storage devices and platforms for business and consumers alike. Our data-centric solutions are comprised of the Western Digital®, G-Technology™, SanDisk® and WD® brands.

Today’s exceptional challenges require your unique skills. It’s You & Western Digital. Together, we’re the next BIG thing in data.

职位描述

Platform Development Engineer

  • Support New Platform Introduction by delivering assigned Platform solutions meeting quality and development targets
  • New platform development for new wafer technology, next generation products, new material qualifications    
  • Define Leading edge Platform Technology Roadmap    
  • New Package Qualification and the delivery of Pre-LVM (Low Volume Manufacturing)
  • Work closely with Cross functional and Cross site’s Product/Process development, Quality, & Design team to understand the Package Design Requirements

职位要求

  • Degree/Master in Engineering, Material, Science/Physics
  • 3-5 years Working Experience in Semiconductors field is preferred
  • Proficient in Chinese and English, both spoken and written 
  • Experienced in storage industry will be an added advantage
  • Statistical tool and knowledge, FMEA, 8D methodology
  • Good Problem solving
  • Good understanding of General Semiconductor packaging product/process/material knowledge including process of Die Prep, Die Attached, Wire Bond, Mold, and Flip Chip
  • Able to work under stress, multi tasking
  • Good interpersonal skills and communication

额外信息

Western Digital thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.

Western Digital is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at [email protected] to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.

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