Company Description
An American computer hard disk drive manufacturer and data storage company, headquartered in San Jose, California. It designs, manufactures and sells data technology products, including storage devices, data center systems and cloud storage services.
It has a long history in the electronics industry as an integrated circuit maker and a storage products company. It is one of the largest computer hard disk drive manufacturers, along with producing SSDs and flash memory devices.
Job Description
Works with stakeholders to address all aspects of procurement management for SIP Packaging Direct Materials especially on IC substrates, including pricing, procurement support, supplier management, supply-base strategy, market trends assessment, etc.
Understand business service needs, request for quotation, negotiate pricing, commercial and supply agreements with suppliers.
✓ Set up “should cost” study and lead quarterly negotiation with suppliers to achieve quarterly and yearly cost reduction.
✓ Negotiate legal contracts such as NDA, MSA with suppliers.
✓ Coordinates procurement activities with manufacturing, quality, planning and engineering departments.
✓ Establish, implement, and administer system and process to evaluate, monitor, report and manage supplier performance and improvement (incl. QBR’s).
✓ Monitor commodity market trends, effectively reflect market dynamic in terms of supply, cost, etc.
✓ Identify potential sources or suppliers in business manner.
✓ Develop and execute a supply-base strategy to meet the Company’s business growth and requirements.
✓ Identify, develop and manage relationships with existing and potential suppliers to meet the established cost, quality and delivery targets.
✓ Collaborate with Engineering, Operations and Quality to identify and drive cost reduction / avoidance activities.
✓ Collaborate with NPI, Engineering, Quality and Operations to effectively manage NPI procurement related activities.
Qualifications
Bachelor degree or above.
✓ 5 years+ procurement related experience.
✓ Familiar with semiconductor assembly packaging direct materials.
✓ Proven ability to achieve results in a fast moving, dynamic environment.
✓ Self-motivated and self-directed, but demonstrated ability to work well with people.
✓ A proven desire to work as a team member, both on the same team and outside of the team.
✓ Ability to troubleshoot and analyze complex problems.
✓ Ability to multi-task and meet deadlines.
✓ Strong communication and presentation skills.
✓ Fluent written and oral English and Mandarin.
✓ Good computer skill on Office software (PPT, Excel, Word).
Additional Information
All your information will be kept confidential according to EEO guidelines.
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