Taiwan - Hsinchu

Engineer will be responsible for characterization and developing cost-effective manufacturing test solutions for DRAM memory products within Qualcomm. Activities will include, but are not limited to working with BIST systems, memory controllers, PHY, IO pads, LPDDR2-4x products, and testing with automated test equipment (ATE). Engineer will be developing Characterization and Test Plans, identifying DFT and test hardware requirements, ATE tests/routines/programs to execute test plans, driving first silicon debug to qualify designs fabricated at external foundries, performing technical data analysis of parametric performance, driving failure analysis to completion, analyzing high volume manufacturing yields and driving test time reduction. Engineer will be working with IC design, system engineering, external vendors, and Hardware applications engineering in a time critical environment across the globe.

2-5 years of hands on experience in each of the following areas
Automated test equipment for memory testing
DDR1/2/3/4, LPDDR1/2/3/4 protocol, timing diagrams and device specifications.
HI-SPEED test and characterization including eye diagram characteristics, differential signals, jitter, signal integrity etc.
C, C++, PERL
DFT: Built In Self Test
VLSI technologies, analog and digital integrated circuits. Semiconductor physics

*Advantest T5503 and T5833 experience *Experience with bench instrumentation including oscilloscopes a plus. *Strong problem solving and debugging skills *Interpersonal and teamwork skills with proven ability to work effectively in a fast-paced environment. *Strong verbal and written communication skills

Required: Bachelor's, Computer Engineering or equivalent experience
Preferred: Master's, Electrical Engineering or equivalent experience