Data Center Hardware Platform Application Engineer
Intel CorporationTaipeiUpdate time: May 21,2022
Job Description

Job Responsibilities:

  • Conducts or participates in multidisciplinary research in the design, development, testing and utilization of information processing hardware and/or electrical components, mechanisms, materials, and/or circuitry, processes, packaging, and cabinetry for central processing units (CPUs) and/or peripheral equipment.
  • Prepares specifications, evaluates vendors, and analyzes test reports.
  • Ensures products conform to standards and specifications.
  • Develops plans and cost estimates and assesses projects to analyze risk.
  • Develops procedures, analysis and design for computer components, products, and systems.
  • Initiates, guides, and coordinates overall design and development of new ideas and products.
  • Responds to customer/client requests or events as they occur.
  • Develops solutions to problems utilizing formal education and judgement.


Qualifications

You must possess a Bachelor's degree and/or a Master's degree in Electrical Engineering or Computer Science with a minimum of seven years of Hardware development, validation or technical support working experience in server/workstation products design and strong customer communication skills.

Additional qualifications include:
1. Demonstrated experience in Intel Architecture (Xeon and Core-i based) Server or Workstation board and system design, including developing the PCB assemblies of server system from concept to production.
2. Multiple related electrical development experiences are required including: Cadence Concept Schematic Capture, reviewing PCB layout using Allegro tools, PCB interconnect schemes, Hot-swap and power components, understanding of mechanical chassis design, and multi board inter-operability schemes.
3. Demonstrated ability to lead cross-organizational technology and product development projects (requirements management, project planning, statement of work creation, execution management, risk management, budget management, etc.).
4. Demonstrated experience developing and leading development of board and system products, including direct experience with mechanical, thermal, electrical, BIOS/firmware, and power design.
5. Proven ability to lead cross-organizational teams where participants are not direct reports, motivate technical contributors, and spur innovation.
6. Effective negotiation skills with proven abilities to achieve mutually successful business outcomes with internal organizations and external customers.
7. Demonstrated tolerance of ambiguity with and flexibility in managing customer changes
8. Strong verbal and written English and Mandarin skills with a demonstrated ability to work across geographies, time zones, companies, and organizations.
9. Would be the plus if has: OS level, Chipset Driver or Graphic Driver skills and issue triage and debug experiences, performance tuning.

Inside this Business Group

The Data Platforms Engineering and Architecture (DPEA) Group invents, designs & builds the world's most critical computing platforms which fuel Intel's most important business and solve the world's most fundamental problems. DPEA enables that data center which is the underpinning for every data-driven service, from artificial intelligence to 5G to high-performance computing, and DCG delivers the products and technologies—spanning software, processors, storage, I/O, and networking solutions—that fuel cloud, communications, enterprise, and government data centers around the world.



Work Model for this Role

This role will require an on-site presence.

TWExperienced HireJR0223249TaipeiDPEA (DP Engineering & Arch)

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