• Intel's recently announced IDM 2.0 strategy includes a plan to significantly expand the manufacturing network, establishing new capacity and capability to meet the accelerating global demand for semiconductors. The external Packaging and Assembly Engineering team (EPAE) will play a critical role in this strategy, leveraging external assembly technologies to deliver leadership products
• Seeking an assembly expert to strengthen the external assembly platform management team through deep understanding of external advanced assembly technology. With the key objectives to help setting up competitive and easy to use assembly platforms you will be expected to support the operative part, structuring and execution platform goals; Build a strong and intimate relationship with the team across multiple levels and organizations, timely execute/drive established tasks in close collaboration with the platform manager and partner teams.
• Lead progress of generation of technical specs and assessments. Direct influence and enablement of platform programs through brad technical experience and expertise.

The ideal candidate should exhibit the following behavioral traits:

• Motivated self-starter / self -driven with strong ability to work independently as well as influence the team.
• Excellent listening, written and verbal communication, tolerance of ambiguity, and commitment to tasks.
• Skills to address complex problems and find solutions.
• Highly collaborative that can effectively drive stakeholders to win results for Intel.
• Excel in leading in a highly matrixed development environment.
• Executes toward results with focus and a sense of urgency.
• Motivated individual with a can-do attitude.
• Is willing to take informed risks to achieve desired team goals.

Qualifications

Qualifications:

• You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

• The candidate must possess a Master's Degree in an Engineering field relevant to Research and Development activities in VLSI design, materials or semiconductor manufacturing or a related field of study.
• 6+ years of relevant experience in the assembly and packaging area.
• 5+ years of hands-on experience leading developments in advanced packaging with respect to advanced assembly technologies.

Preferred Qualifications:

• A Ph.D. or master degree in an Engineering field.
• Experience with design and design rules.
• Experience in advanced packaging technologies development or pathfinding
• Experience in virtual basic programming and CAD drawing

• Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.

Intel's Sales and Marketing (SMG) organization works with global customers and partners to solve critical business problems with Intel based technology solutions. SMG works across business units to amplify the customer voice and deliver solutions that accelerate their business. We work across numerous industries, including retail, enterprise and government, cloud services and healthcare as examples. The operations team focuses on forecasting, driving alignment with factory production and delivering efficiency tools and our marketing capability drives demand and localized marketing in locations around the globe. Our sales force navigates a complex partner and customer ecosystem while shaping product roadmaps, driving value for our customers, and collaborating to harness emerging technology trends to deliver comprehensive solutions.