Req Id: 134748

Job Description:

As a Simulation Engineer at Micron Technology, Inc. you will work in the R&D Package design and development group on thermal/mechanical simulations for advanced semiconductor packaging. In this position, you will be responsible for influencing mechanical and thermal package designs, and furthering the technology of semiconductor packaging. The scope is to address all mechanical and thermal aspects of packaging technology and associated material and process interactions. Focus will be on solutions to meet increased demands for small form factor packages with constrained physical and thermal environments. Candidate will be responsible for the modeling and characterization of mechanical and thermal response of the IC package using analysis and measurement techniques. This position will interface with package design, electrical and physical characterization, assembly R&D and other process module teams.

Responsibilities:

• Provide thermo-mechanical simulation reports to support pathfinding efforts, technology development, and new product introduction
• Guide test vehicle development to improve simulation correlation to empirical data
• Provide recommendations to meet product requirements

Successful candidates must have:

• Solid knowledge through academic coursework, or experience required, in thermo-mechanical multi-physics modeling and measurements of IC packaging and related areas.
• A strong background in mechanical and thermal sciences with emphasis on both analytical and measurement methods.
• Thorough knowledge of material properties and material property test methods.
• Working knowledge through academic coursework or experience in numerical simulation of material and

structural behavior (non-linear deformation, viscous behavior, etc.).

• Working knowledge in applying Finite Element Modeling (FEM) and/or Computational Fluid Dynamics (CFD) in related areas; and familiarity with software tools such as ANSYS, Abaqus, FloTHERM, and IcePak.
• A good understanding of semiconductor packaging processes and materials and technology and trends such as; organic substrate properties, over molding materials and properties, wire-bonding materials and methods, C4 or Cu Pillar attachment methods, etc.
• Strong oral and written communication skills.
• Ability to work in a team environment and interact with other engineers to define and implement numerical and lab experiments for feasibility and validation of concepts and solutions to support new package technology

development.

Degree required:

• MS or PhD

Academic Discipline(s):

• Mechanical Engineering, Materials Engineering, Physics, or related discipline

Experience Required:

• Emphasis on numerical simulations of materials and structures