Job Description

Electronics Process Development Engineer will work as part of a design/development team providing electronics manufacturing knowledge and driving the design to ensure highly manufacturable new products. Responsibilities will include supporting new products via DFM reviews, manufacturing tool design, and in-person support during prototype builds and through the product launch cycle. The candidate will support the design team and, in parallel, act as the liaison to the manufacturing plant to ensure that processes are developed, documented and capable of meeting the Bose internal quality, cost and attainment requirements.

Responsibilities

• Engage in early design review activity to influence PCB layout and DFM compliance
• Represent electronics manufacturing as part of new product development team.
• Develop set based design evalations to test design/ process options to optimize designs and processes.
• Assess critical design & component attributes for use in PCB assembly process development

- Drive manufacturing deliverables - documentation, quality and cycle time goals, product cost, etc.

• Support prototype manufacturing processes, with emphasis on early risk identification & resolution
• Data collection and anlysis of proto build results to drive process and design improvements
• Specify, order and support capital equipment purchases
• Engage in advanced process development & technology roadmap work outside of product development

Skills

• Prior experience in electronics manufacturing, SMT & thru-hole technology
• Knowledge of standard process equipment: screen printing, solder paste inspection, component placement, reflow soldering, automated optical inspection, PCBA depaneling
• Experience in tooling design & development as well as capital equipment specifications.
• Must be able to work collaboratively with local and remote design and manufacturing teams.
• Must have strong written and verbal communication skills
• Training in structured problem solving tools: 5-Why, 8-D
• Ability to develop and utilize APQP tools: PFMEA & CP

- Working knowledge of industry standards: IPC-A-600, IPC-A-610, J-STD-001

• Experience with various materials & chemistries: PCB surface finishes, solder pastes, fluxes, conformal coatings, bonding & underfill materials

Education Requirements

• Bachelor of Science in an Engineering Discipline

Professional Work Experience Requirements

- 5 - 7 years working in electronics manufacturing with responsibility for PCB assembly

• Experience must include new product introduction & new process development activities.
• Experience working with contract / joint development manufacurers is a plus.

上班地址：嘉里建设广场一座