Engineer - Quality Engineering Lab
MicronTaizhongUpdate time: August 28,2019
Job Description
Req. ID: 138270
Job Description
Module qual and BLR operation lab includes qualification of Module: Temperature cycling test, Biased High accelerated stress test, Vibration temperature cycling, mechanical tests and system level test. Board Level reliability (DC): Temperature cycling and board level drop test and component and die level mechanical test (3pt, 4pt, ROR, BOR and Torsion).
As Reliability Engineer focus on lab Operation, you will be required to run lab operation smoothly. Complete qualification ad jobs in committed turnaround time (TAT), Improve TAT toward best in class (BIC). Measure data analyze and present result to requestors and customers. Define specification and pass-fail criteria based on best available statistical analysis methods and customer requirement. Improve operational errors and develop error proof process and system.
This position also required to work with electrical failure analysis (EFA) , physical failure analysis and engineering team to understand failure mode and RC and risk-assessment.
As Reliability Engineer lab you will be also responsible to coordinate and cow work with cross functional departments to develop and transfer new test methods, develop customer required tests, specification and execution.
Experience in automation (tools, system , lab and analysis) would have advantage.
Responsibilities and Tasks
- Work with team lead, technician and engineers to improve lab operational efficiency.
- Improve productivity and TAT and apply out of box and BIC approach.
- Work with vendor to improve tools capability and capacity.
- Drive long and short-term projects related with Module qualification, Solder Joint reliability and Mechanical and System testing.
- Design and develop In Situ test characterization tools to achieve real time detections.
- Up to date on industry standards (JEDEC, AEC etc.) and periodically review internal requirements and specifications to align and meet industrial standards.
- Work with product engineering and RMA team to develop component and system level failure understating and transfer and enhance team skills.
- Early engage with PDE on new characterization techniques and test methods and spec developments.
- Plan DOEs for marginality analysis, maintain database and work with packaging team to improve package quality and reliability.
- Write manuals and SOP and technical papers related with new tests and improvements.
- Strong execution to achieve committed due dates.
- Drive automation, smart processes and smart lab, centralize virtual lab and system level traceability.
Education: Master in one of below field.
- Mechanical Engineering
- Electronics
- Materials Engineering
- Physics
Phd will be considered as well.
Experience
- Experience in Semiconductor or semiconductor industry or related materials, process, research and development.
- Working experience in laboratory on silicon related products and packages.
- Module, SSD or DRAM related experience in Electrical Testing, Failure Analysis, Mechanical Testing or Reliability Engineering.
Mindset:
- Objective driven
- Problem Solving
- Engineering and Scientific approach
- Team work
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.
For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s Human Resources Department at 1-800-336-8918 or 208-368-4748 and/or by completing our General Contact Form
Keywords: Taichung || Taichung City (TW-TXG) || Taiwan (TW) || Quality || Experienced || Regular || Engineering || Not Applicable || Tier 4 ||
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