Job Function

• Interact effectively with other groups such as Production Engineering, New Product Introduction, MEMS Design, Product Testing, and Product Quality Engineering, and Quality Assurance groups to perform failure analysis tasks. For examples:

  • Interact with NPI and Product Engineering Team to analyze MEMS product failure to identify the root cause of the failure of new product and new process, plus reliability failures.

  • Interact with Customer Quality Management team to analyze customer RMA.

  • Interact with product engineering and foundry team to analyze yield reject to improve manufacturing yield

  • Characterize MEMS products physically and electrically

  • Develop 1) new characterization tool and 2) application of characterization tool

• Supporting look-ahead testing, characterization, & simulation to assist in process/design selection, assess reliability risks leading to product qualification.For example:

  • Interact with MEMS design & NPI team to understand the design change and develop design/structure-based failure analysis plan.

  • Develop/Implement characterization protocols & “new” FA techniques to assist in root cause determination of device failures.

  • A first line MEMS device simulation, modeling, and validation to provide feedbacks on MEMS design/process selection.

• Review/analyze data from characterization, reliability evaluations and product qualifications and issue summary reports.

• Calibrate, maintain and debug the MEMS characterization and reliability/qualification test tools and platforms.

• Assist in defining database infrastructure for failure analysis & customer returns.

  
  

Required Skills & Experience

• Minimum of two years’ experience in semiconductor failure analysis, characterization, and/or reliability testing.

• In-depth knowledge and experience in MEMS design & process

• Hands-on experience in testing and characterization.

• Demonstrated proficiency using test and characterization tools such as Lab View, Matlab, etc.

• Strong verbal and written communication skills in English

• Knowledge and experience in SEM, FIB, TEM.Knowledge and experience in element analysis such as EDX, Auger, XPS and SIMS is a plus.

• Experience writing documentation and reports

  
  

Additional Skills:

• Prior experience with CMOS, MEMS, or semiconductor manufacturing.

• Hardware upgrading and debugging

• Analytical script/tool development

• Test data acquisition and database systems

• Statistical data analysis tools such as JMP

  
  

Educational Requirements Bachelor ’s degree in Physics, Electrical/Mechanical Engineering or equvilent