This opportunity is within the Package failure analysis team. The team provides fundamental root cause analysis of yield and reliability issues supporting ATTD package technology development and develops industry leading state of art analytical capabilities.
 

The responsibilities include but are not limited to the following:

• Identifying component failures and researching process/materials improvements to enhance yield, performance, quality and reliability of next generation Product and Package technologies.

• Conduct hands on lab work, define failure analysis strategy, evaluate the electrical and thermal mechanical characteristics of integrated circuits to determine the root cause of failures and recommend corrective actions working with cross functional teams.

• Owns the development of innovative fault isolation and failure analysis methods to accelerate failure identification and mechanism understanding on future technologies and products.

• Drives technology transfer to high volume manufacturing and owns proliferation of shared learning across sites.

• Maintains necessary records and reports.

• Performs other related duties as required or as directed.

• Familiarity with packaging materials, assembly process, design of experiments, and data analysis.

• Communication and decision-making skills.

• Team player, assumes ownership of issues and is self-driven, willing to deliver results under pressure in a fast-paced environment.

• Organized and pays attention to detail.

• Planning/time management skills with willingness work across multiple projects.

This is an entry level position and compensation will be given accordingly.

What we offer: 

• We give you opportunities to transform technology and create a better future, by delivering products that touch the lives of every person on earth. 

• As a global leader in innovation and new technology, we foster a collaborative, supportive, and exciting environment where the brightest minds in the world come together to achieve exceptional results. 

• We offer a competitive salary and financial benefits such as bonuses, life and disability insurance, opportunities to buy Intel stock at a discounted rate, and Intel stock awards (eligibility at the discretion of Intel Corporation). 

• We provide benefits that promote a healthy, enjoyable life: excellent medical plans, wellness programs, and amenities, time off, recreational activities, discounts on various products and services, and much more creative perks that make Intel a Great Place to Work! 

We're constantly working on making a more connected and intelligent future, and we need your help. Change tomorrow. Start today.

Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Experience listed below would be obtained through a combination of your schoolwork and/or classes and/or research and/or relevant previous job and/or internship experiences.

Minimum Qualifications:

Candidate must possess the degree by employment start date. 

• Candidate must possess Master Degree with 3+ years of experience in Materials Science, Mechanical Engineering, Electrical Engineering, Chemistry, Solid-state Physics or related fields.

Preferred Qualifications:
1+ year experience in one or more of below areas:

• Semiconductor fabrication and device physics, Electron microscopy, Polymer materials, Metallurgy, Mechanical behavior of materials, Surface analysis, and Reliability statistics.

• Electrical Fault Isolation, advanced imaging techniques, nondestructive and destructive failure analysis methods, material analysis and characterization methods.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Work Model for this Role

This role will require an on-site presence.