Dialog Semiconductor is a leading provider of custom, highly-integrated and configurable mixed-signal ICs, ideal for a wide range of applications, including smartphone, automotive, computing & storage and the IoT. We are a socially responsible employer pursuing programs that benefit our employees, stakeholders and community, and are backed by world-class manufacturing partners.

Dialog’s custom power management, configurable mixed-signal and highly-integrated connectivity ICs deliver outstanding efficiency, flexibility and performance advantages. Dialog’s ICs make it possible to develop the next generation of smart devices for consumers and businesses by enhancing product functionality, accelerating the pace of innovation and powering the smart connected future.

Dialog has a renowned reputation for flexible, dynamic support and world-class innovation. The world’s leading electronics manufacturers and suppliers trust Dialog to deliver, thanks to our decades of experience as an established business partner in the rapid development of custom ICs.

Dialog operates a fabless business model and is a socially responsible employer pursuing many programs to benefit the employees, community, other stakeholders and the environment we operate in. Dialog Semiconductor plc is headquartered in London with a global sales, R&D and marketing organization. In 2018, it had US$1.442 billion in revenue and was one of the fastest growing European public semiconductor companies. It currently has approximately 2,100 employees worldwide. The company is listed on the Frankfurt (FWB: DLG) stock exchange (Regulated Market, Prime Standard, ISIN GB0059822006) and is a member of the German TecDax index.

For more information, visit www.dialog-semiconductor.com.

As part of our continued growth, we seek a (Graduate) Advance Package R&D Development Engineer to 1) research & develop Advance Packaging solutions for future packaging and product needs, to enable Dialog Product Technology in IC Packaging to always be at the leading edge, ahead of customers and to ensure to meet “time to market” needs; 2) liaise and work closely with Dialog Advanced Package Development Team of Engineers, to support and drive research of Advanced Package Development activities within Dialog and Research Institute that work side by side with in OSAT and Subcons.

Working in Global Manufacturing team based in Taichung, you will:

• Contribute to research and updates of Dialog’s Package development & Package roadmap on a quarterly basis.
• Explore /Research and develop New Package Technologies to support Dialog new products and Business Units.
• Provide help on Idea Generation -> Patents & Invention of Advance Packaging Development and Techniques that support Dialog Product Applications.
• Support fellow APD development Engineers with regards to investigation and research on Development trends and Innovation of new Generations Advance Package technology.
• Work closely with the Assy Eng Group (Package Design & Simulation, Project Management, Documentation, Offshore Sustaining), and use these resources to assist and line up Advanced Packaging development activities.
• Help to plan and organize APD Workshops
• Help to define workflow of Package Development, checkpoints and Targets.
• Help to promote and present package Technology in Internal and External Conferences.

• Good understanding of research activities on semiconductor/engineering IC Packaging environment
  • Understanding of Research and Development on semiconductor packaging and technology.
  • Basic understanding and knowhow of Semiconductor Materials and Processes.
• Strong communication and interpersonal skills.
  • Good ability to communicate effectively at all levels
  • Good presentation skills with regards to Technology, research studies and ideas.

Desirable:

• Knowledge on Research in Semiconductor Engineering/Electronics Fields specially in packaging.
• Language skills – English is essential.
• Basic Knowledge of MS Projects.
• Ability to work in multicultural environment.
• Innovative thinking with regards to research Technology and Development of Semiconductor IC packages.
• Engineering Degree or similar desired (Electronic / Physics / Mechanical).

We passionately believe that working at Dialog, you will be joining the brightest, most diverse and ambitious talent in the Semiconductor Industry. We are proud to have won numerous awards and designs, including exclusive patents that have assisted us to years of double-digit growth in this highly competitive industry. With growth planned for 2019, the opportunity for talent to progress at Dialog could not be greater. We are fast becoming the employer of choice within microelectronics chip design, power management solutions, short-range wireless connectivity and AC/DC power conversion.

If you'd like to explore working for Dialog Semiconductor further, then it's time we heard from you. Click below and apply now.

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