Heterogeneous Platforms Research Scientist
Intel CorporationHillsboroUpdate time: July 20,2022
Job Description

Join Intel-and build a better tomorrow. Intel is in the midst of an exciting transformation, with a vision to create and extend computing technology to connect and enrich the lives of every person on Earth. So join us-and help us create the next generation of technologies that will shape the future for decades to come.

Intel Labs is Intel's research organization responsible for driving cutting-edge research in break-through technologies to fuel Intel's product pipeline. Our mission is to identify, explore and innovate on pioneering technologies and high-risk opportunities ahead of business unit investment and demonstrate proof-of-concept prototypes, while maturing nascent technologies for high-volume market deployment. Intel Labs also engages the leading thinkers in academia and industry in addition to partnering closely with Intel business units.

This position is in Intel's Heterogeneous Platforms Lab in Intel Labs. You will be contributing to Intel's multi-die integration and 2.5D/3DIC systems research. Research activities include research and design of compute/memory blocks, interfaces, clocking and IO circuits. The research will also involve die-package interface simulations with modeling of new die attachment technologies.

 

    • The candidate will initiate the design, development, execution and implementation of scientific research projects to fuel Intel's growth in the areas of computing, communications, technology and manufacturing and new business opportunity.
    • Will investigate the feasibility of applying scientific principles and concepts to potential inventions and products typically 5+ years prior to landing on a product roadmap.
    • Plans and executes laboratory research.
    • Maintains substantial knowledge of state of the art principles and theories, and contributed to scientific literature and conferences.
    • Participates in development of intellectual property. Will also coordinate interdepartmental activities and research efforts.
       

What we offer:

    • We give you opportunities to transform technology and create a better future, by delivering products that touch the lives of every person on earth.
    • As a global leader in innovation and new technology, we foster a collaborative, supportive, and exciting environment where the brightest minds in the world come together to achieve exceptional results.
    • We offer a competitive salary and financial benefits such as bonuses, life and disability insurance, opportunities to buy Intel stock at a discounted rate, and Intel stock awards (eligibility at the discretion of Intel Corporation).
    • We provide benefits that promote a healthy, enjoyable life: excellent medical plans, wellness programs, and amenities, time off, recreational activities, discounts on various products and services, and much more creative perks that make Intel a Great Place to Work.
       

We're constantly working on making a more connected and intelligent future, and we need your help. Change tomorrow. Start today.

 

This is an entry level position and compensation will be given accordingly.


Qualifications

You must possess the below requirements to be initially considered for this position. Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your schoolwork and/or classes and/or research and/or relevant previous job and/or internship experiences



Minimum Qualifications:

The candidate must possess a Ph.D. degree in Electrical Engineering or related discipline.

1+ years of experience in the below areas:

  • RTL design
  • Circuit and interconnect modeling and simulation
  • 2.5D/3D platforms
  • Memory architectures and design
  • Physical design
  • Complementary Metal-Oxide Semiconductor (CMOS) chip design.

     

Preferred Qualifications:

  • Should have a publication history in top-tier conferences/journals
  • Experience in multi-die stacking and interface protocols
  • Experience with 3D integration technology, interface circuits and lab measurements.

Inside this Business Group

Intel Labs is the company's world-class, industry leading research organization, responsible for driving Intel's technology pipeline and creating new opportunities. The mission of Intel Labs is to deliver breakthrough technologies to fuel Intel's growth. This includes identifying and exploring compelling new technologies and high risk opportunities ahead of business unit investment and demonstrating first-to-market technologies and innovative new usages for computing technology. Intel Labs engages the leading thinkers in academia and industry in addition to partnering closely with Intel business units.


Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.



Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.



Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site.

USCollege GradJR0228564HillsboroIntel Labs

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