We're looking for a motivated, and passionate engineer to join Intel's Advanced Design Technology and Solutions (ADTS) group within Assembly Test Technology Development (ATTD).

You will leading the transformation of Intel’s 3D packaging and co-design environment to deliver a scalable, secure, and traceable end to end package design and system co-design eco system and workflows on cloud.

You will be responsible for defining, executing, and managing the enablement of the transformation.

You will advance and standardize cloud consumption for modern and legacy applications.

You will work with EDA partners, business partners, internal applications development team, infrastructure, and hardware organizations.

You will also assess risks, anticipate bottlenecks, provide escalation management to ensure timely delivery of the project.

Hybrid working model for this position.

Qualifications

You must posses the below minimum qualifications to be initially considered for this position. Preferred qualifications are in adition to the minimum and are considered a plus factor in identifying top candidates. 

Minimum Qualifications

• Bachelor's with 6+ years of experience or master’s degree with 4+ years of experience, or PhD with 2+ years’ experience in Electrical Engineering, Computer Science, Computer Information Systems, Software Engineering, or Computer Engineering

• At least 5-years’ experience with cloud architecture and necessary implementation features (OS, networking, data storage, multi-tenancy, virtualization, containers, security, server software, file systems, access management, orchestration, elastic scalability)

• Knowledge of operating system internals, L2/L3/L4 networking, and storage appliance internals

• At least 3+ years of proven experience in technical management of mid to large programs across organizations

• Interface with customers and partner organizations from remote sites worldwide.

Preferred Qualifications

• Knowledge/background in Package, PCB design, or IC digital design.

• Knowledge of working with Siemens EDA, Cadence, or Synopsys design tools.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site.