Manufacturing Process Engineer
Texas InstrumentsChengduUpdate time: August 26,2019
Job Description
About TI
Texas Instruments Incorporated (TI) is a global semiconductor design and manufacturing company that develops analog ICs and embedded processors. By employing the world’s brightest minds, TI creates innovations that shape the future of technology. TI is helping about 100,000 customers transform the future, today. We’re committed to building a better future – from the responsible manufacturing of our semiconductors, to caring for our employees, to giving back inside our communities and developing great minds. Put your talent to work with us – change the world, love your job!
Texas Instruments Incorporated (TI) is a global semiconductor design and manufacturing company that develops analog ICs and embedded processors. By employing the world’s brightest minds, TI creates innovations that shape the future of technology. TI is helping about 100,000 customers transform the future, today. We’re committed to building a better future – from the responsible manufacturing of our semiconductors, to caring for our employees, to giving back inside our communities and developing great minds. Put your talent to work with us – change the world, love your job!
Job Descriptions:
- Being responsible for developing gold and copper wire bond process capability, and building process windows to support volume productions, including collaborate with Equipment, Manufacturing and QRA on troubleshooting and problem solving
- Being responsible for wire bond total performance improvement programs, including but not limited to quality, tool stability, PPH, cost and operation efficiency
- Work with Packaging R&D teams in Headquarter and Chengdu on new product development, and the transitions from engineering mode to volume productions
- Work with worldwide Assembly/Test Factories on worldwide projects and best practice sharing
Minimum Requirements:
- Bachelor degree or above with major in material, mechanical, or electrical engineering
- 5 years’ or above experience in Gold or Copper wire bond engineering. Experiences in wire bond equipment will be a plus
- Fluent communication in both Mandarin and English, presentation skill and technical report writing
- Being able to work under pressure and in international company environment
- Always positive to collaborate, solve problems and commit to success and excellence
Primary Location CN-CN-Chengdu
Work Locations Chengdu > China, Chengdu AT No.8-8 Kexin Road, High-tech Zone(West) Chengdu 611731
Job Manufacturing
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Regular
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Job Posting Aug 16, 2019, 2:58:52 AM
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