Who Are We?

Emerging Growth Incubation (EGI) Group is responsible for creating an environment within Intel to generate new billion-dollar businesses leveraging Intel's competitive advantages. 

We focus on new business opportunities and identify, incubate, and scale the next "big thing" for Intel.

we're looking for a student that will do package and PCB layout and join the development of the next phase of an automotive Radar.
Involving Si design floor, Si bumpout, Package and PCB technology and product cost.
The student will also take part in the system, package thermal and mechanical modeling

Responsibilities:

• Design and optimize different Radar packages layout including 80GHz RF components.
• include intensive work with Si design teams in order to get optimized Si floorplan and bumpout that will meet best package and PCB routing.
• Design also PCB layout, working closely with HW team engineers on the design.

Qualifications

What are we looking for?

• Student to BSc of mechanical engineering
• thermal dissipation knowledge - advantage
• Familiarity with electrical engineering - advantage
• Curious for learning new areas and team worker

The mission of the Emerging Growth and Incubation (EGI) group is to create an environment to identify, incubate and scale new billion-dollar businesses leveraging Intel's competitive advantages. EGI is a fast paced, dynamic and startup-like organization that is responsible for incubating new ideas within Intel. We have over 1500 employees globally. Our portfolio includes HW, SW, Solutions and SaaS businesses.