Performance Objectives:

• Extract device SPICE models using ICCAP, NoisePro, OrCAD, and other in-house software tool kits.
• Work with our US and EU Lab to setup and perform electrical measurements on various devices.
• Support technology R&D methodology from TD to Design Enablement.
• Document characterization and modeling work according to established procedures.
• Evaluate and support implementation of new characterization and modeling methods.
• Guide and assist the development of test structures and characterization module frames.
• Provide performance assessment and feedbacks for device development engineering.
• Interface with PDK, Design Methodology, Design, Foundry and external customers to resolve characterization/modeling issues and improve characterization/modeling procedures.
• Work jointly with modeling groups worldwide to perform characterization/modeling tasks.
• Perform other tasks as may be from time to time assigned.

Required Qualifications:

• MS Degree in Electrical Engineering/Physics/Material Science or related field plus 0-2 years of experience. Or BS with 3+ years.
• In-depth understanding of semiconductor device physics.
• Solid knowledge in DC, AC, noise and RF characterization.
• Previous Design/Device fabrication/Process integration experience desired.
• UNIX/LINIX shell, PERL programming experience is desired.
• Strong English communication capability
• Good team player

Preferred Qualification:

• Previous experience with layout design tools such as Cadence or Mentor is a plus.
• Previous experience with BCD technology design/simulation/modeling is a plus.
• Previous experience with TCAD tools is a plus.
• Previous experience with revision control systems such as CVS or Cliosoft is a plus.

上班地址：凯旋路399号龙之梦雅仕大厦7楼，Unit 01-07