• Performs research, design, and development of test equipment software, library, program flow, fixture, hardware, probing, module and/or tester for main and/or peripheral printed boards assembly (PBA).
• Responsibilities include technology pathfinding, architecture development, design material gathering, development of test strategy, device library, determining test parameters, specify test to be performed, conducting design review, designing test/fixture, performing fixture acceptance, debugging test/fixture, resolving design and implementation issues, performs testability and fault coverage analysis, meeting production quality and reliability requirement, and updating test/fixture as needed through product life cycle.
• Plans and schedules daily tasks, uses judgment on a variety of problems requiring deviation from standard practices. Inadequacies and erroneous decisions would cause moderate inconvenience and expense.

Qualifications
Qualifications

In this position, you will work on BI/ATE cutting edge 3D NAND memory and Intel Optane 3DXP Storage technologies inside of NSG (Non-Volatile Memory Solution Group)

• One of the fastest growing businesses at Intel. You will be responsible for Component Test Development for NSG's high performance, revolutionary 3D NAND/ Optane 3DXP component products.

You will:

• Integrate, test, install, configure, and/or support Factory Test environment readiness
• Coordinate factory requirements, mapping them to automation systems capabilities, and recommending
• Investigate efficiency recipe to optimize test program and script to robust Mfg test flow
• TTR requirement

Technical solutions

• Apply advanced troubleshooting to OEM production system problems
• Drive continuous improvement efforts to meet production tester health goals, as well as emerging

Requirements

• At least 2-5 years of C language

Non-Volatile Solutions Memory Group: The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices. The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.