You will be a member of the growing Oregon Wafer Level Assembly (OWLA) organization at RA4 on the Ronler Acres campus. Oregon Wafer Level Assembly is an integral part of Intel's new FOVEROS technology.

As a Process Engineer, you will be responsible for all aspects of your assigned module including safety, quality, output, cost of operation, and labor productivity. Responsibilities include, but are not limited to:

• Collaborating with OWLA and Technology Development engineering teams to develop a first of a kind toolset and deliver process transfer to High Volume Manufacturing (HVM).
• Defining roadmaps to meet requirements, goals and milestones for a new technology process.
• Defining and establishing flow, procedures, and equipment configuration for the module.
• Designing, executing and analyzing experiments necessary to meet engineering specifications.
• Working effectively with the equipment supplier to identify shortcomings, propose and evaluate hardware modification to mitigate issues.
• Establishing process control systems for the module.
• Sustain the day-to-day operations of your area by responding to, containing, and dispositioning safety and quality concerns, addressing down tools, and implementing solutions to prevent repeat incidents.
• Continuously improve your area by proactively identifying and implementing safety and ergonomic improvements, excursion prevention measures, methods to increase tool utilization, and reduce cost.

The ideal candidate should exhibit the following behavioral traits:

• Written and verbal communication skills.
• Influence others and build consensus and trust within a team.
• Making technical decisions and providing technical direction.
• Learning new processes and tools.
• Analytical and problem-solving skills

Qualifications

You must possess the below minimum qualifications to be initially considered for this position.  Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

• Candidates must possess a Master's degree in Physics, Chemistry, Electrical, Chemical or Mechanical Engineering, Material Science, or equivalent STEM field and 3+ years in a semiconductor environment or assembly experience.

• PhD degree in Physics, Chemistry, Electrical, Chemical or Mechanical Engineering, Material Science, or equivalent STEM field and 1+ years in a semiconductor environment or assembly experience.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Work Model for this Role

This role will require an on-site presence.