HW PCB Physical Designer for Wireless communication product-WiFi, BT Integration as a part of HW R&D design team.Physical Design of circuits on FR4 and BT Laminate substrate which is targeted to be products on the wireless group.Design optimization of Si-Package-Board as part of Co-Design activity to assure best performance and lowest cost of our products.Ownership of PCB Layout from placement to T.O Package and support though manufacturing, and Assembly Design Rules implementation per specific Substrate Technology.Student position

Qualifications

Student of Electrical Eng/Practical Engineer with at least 4 semesters till graduation.
Knowledge in MS Office programs including outlook, Excel, Visio, etc.
Excellent communication skills and working with multiple interfaces
Excellent English
Experience in mentor CAD Tool - advantage
Experience in RF Physical Design - advantage
Experience in AutoCAD/SolidWorks - Advantage
Position in PTK/IDC

Availability for at least 20 hours per week

Inside this Business Group

The Client Computing Group (CCG) is responsible for driving business strategy and product development for Intel's PC products and platforms, spanning form factors such as notebooks, desktops, 2 in 1s, all in ones. Working with our partners across the industry, we intend to continue to advance PC experiences to deliver the real-world performance people demand. As the largest business unit at Intel, CCG is investing more heavily in the PC, ramping its capabilities even more aggressively, and designing the PC experience even more deliberately, including delivering a predictable cadence of leadership products. As a result, we are able to fuel innovation across Intel, providing an important source of IP and scale, as well as help the company deliver on its purpose of enriching the lives of every person on earth.

Other Locations

Israel, Petah-Tikva

Work Model for this Role

This role will require an on-site presence.