We are looking for a highly motivated Computer/Electrical/Computer Science engineer undergrad intern to join the Test-Chip Team for Intel's next generation of IPs and SOCs. As part of the team, you will be working with experienced engineers, developing package design for several silicon technology nodes.

Responsibilities of this role include, but are not limited to:  

• BGA/LGA package design for characterization of various test chips that employs state of the art digital and/or analog Ips
• Collaborating with IP teams, full chip teams, and board designers to create necessary documentation and design/test plans needed to carry on package and board designs.

 

Behavioral Traits 

• Good communication, interpersonal and problem-solving skills;
• Highly motivated, skilled at working effectively both independently and as a team;
• Collaborative skills to work across the organization to achieve goals and thrive in a team-oriented environment;

 

Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your schoolwork/classes/research and/or relevant previous job and/or internship experiences.

Minimum Qualifications

 

This position is not eligible for employment-based visa/immigration sponsorship.  Intel sponsors individuals for employment-based visas for positions where we experience a shortage of US Workers. These skills shortage roles are typically STEM contributing positions requiring a Master's or PhD degree, or a Bachelor’s degree with three years’ related  job experience.  This position does not qualify for Intel Sponsorship because it is either (1) a non-STEM contributing position, or (2) a STEM position that only requires a Bachelor’s degree and less than three years’ experience. 

The candidate must be pursuing a Bachelors degree in Computer Engineering, Electrical Engineering, Computer Science or related field.

3+ months of experience in:

• Semiconductor device and technology
• AutoCAD or similar tools
• Microsoft Office
• UNIX

 

Preferred Qualifications

3+ months experience in:

• Post-silicon debug
• Package or Board design
• RTL and/or circuits design
• Mixed signal design

Inside this Business Group

IP Engineering Group's (IPG) vision Build IPs that power Intel's leadership products and power our customer's silicon. We want to attract & retain talent who get joy in building high quality IP and share our core belief that IP is fundamental to transforming Intel's silicon design process. IPG's guiding principles will be ensuring Quality (Zero Bugs), Customer Obsession (Delight our Customers) and structured Problem Solving. We are a fearless organization transforming IP development.

Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site.