Taiwan - Hsinchu

* Qualcomm PME is looking for a highly motivated and passionate package mfg. engineer. The candidate is responsible for advanced SiP / module packaging assembly in the markets of Mobile, RFFE, AU..etc. * To work seamlessly with upstream NPI team to develop and bring up the BKM, CLR qualification, OSATs audit all the way to production ramp-up. * To lead yield continuous improvement and quality trouble-shooting to maintain a healthy supply chain. * To proactively look for opportunities for packaging process baseline improvement, cycle time expediting and OEE enhancement. * To work with multi-functional team and OSATs to PCN materials, tooling, equipment to meet the cost quality, capacity and delivery targets. * frequent domestic or some international travel will be required.

5 ~ 10 years experience in packaging process and manufacturing

Expertise in FCCSP, WLP and SiP module process and integration.

Process DoE plan, execute, statistical data analysis and JMP skills.

A good and fundamental understanding of package reliability and FA.

Understanding of wafer fabrication, GaAs wafer back-end processes is a plus.

Good communication and interpersonal skills.

Able to work independently while still being a good team player.

Self-driven, accountable and passionate personality

Fluent in Mandarin Chinese and English

* Understanding of organic laminate manufacturing process. * A good understanding of thermal and warpage simulation and behavior. * Being a process engineer with expertise in dicing, molding, EMI shielding. * Proficiency in material and package characterization data analysis, and statistical data analysis.

Required: Bachelor's, Mechanical Engineering or equivalent experience
Preferred: Master's, Materials Science or equivalent experience