Dialog Semiconductor is a leading provider of custom, highly-integrated and configurable mixed-signal ICs, ideal for a wide range of applications, including smartphone, automotive, computing & storage and the IoT. We are a socially responsible employer pursuing programs that benefit our employees, stakeholders and community, and are backed by world-class manufacturing partners.

Dialog’s custom power management, configurable mixed-signal and highly-integrated connectivity ICs deliver outstanding efficiency, flexibility and performance advantages. Dialog’s ICs make it possible to develop the next generation of smart devices for consumers and businesses by enhancing product functionality, accelerating the pace of innovation and powering the smart connected future.

Dialog has a renowned reputation for flexible, dynamic support and world-class innovation. The world’s leading electronics manufacturers and suppliers trust Dialog to deliver, thanks to our decades of experience as an established business partner in the rapid development of custom ICs.

Dialog operates a fabless business model and is a socially responsible employer pursuing many programs to benefit the employees, community, other stakeholders and the environment we operate in. Dialog Semiconductor plc is headquartered in London with a global sales, R&D and marketing organization. In 2018, it had US$1.442 billion in revenue and was one of the fastest growing European public semiconductor companies. It currently has approximately 2,100 employees worldwide. The company is listed on the Frankfurt (FWB: DLG) stock exchange (Regulated Market, Prime Standard, ISIN GB0059822006) and is a member of the German TecDax index.

For more information, visit www.dialog-semiconductor.com.

As part of our continued growth, we seek a Package & Material Simulation Engineer to provide support in the execution and analysis of Thermal, Mechanical and Board Level Reliability (Thermal Cycling, Drop & Bend) Simulations in order to ensure optimum package design and material sets have been selected; simulations of new Package and/or for implementation in Dialog’s future products; thermal measurement and correlation; material Characterization and Measurements.

Working in Global Manufacturing team based in Taichung/Hsinchu, you will:

• Participate in the Package Bill of Materials selection to ensure optimum Thermal requirements are met.
• Perform Thermal, Mechanical and Board Level Simulations during the Package design phase and provide feedback to the Project Team.
• Generate analysis reports for internal and external customers with emphasis on design/simulation issues and proposed fixes while meeting tight schedules and strict cost targets.
• Liaise closely with Dialog’s Offshore Assy Project Development Engineer to discuss and evaluate new / advanced material evaluations following Simulation review and discussion.
• Visit Key Subcontractors as required to discuss new Package / Material development for consideration / implementation in Dialog’s Projects / Products.
• Provide accurate and timely status reports of activities relating to Project and Material development.
• Perform Thermal Measurements and Correlations.
• Present detailed weekly reports of activities and progress to team leader and line manager.

• Minimum 3 years of experience in Thermal Simulation generation, execution and analysis using Finite Differential Modelling (FDM) method and Industry Std Simulation Software ( eg. Ansys IcePak and Thermo Mechanical Simulation s/w ) and / or Thermo-Mechanical simulation (Package and board level) using Ansys Mechanical.
• IC Assembly Packaging experience (Construction / Materials).
• IC Packaging design and manufacturing experience (optional).
• Familiarity with package and PCB layout tools.
• Hands on thermal measurement experience of using 3ster
• Strong task management & planning ability
• Strong interpersonal and communication skills.
• Professional English language skills
• Proficiency in providing accurate timescales for Simulation completion.
• A good team player.
• Willing to work in an international team.
• Degree in Material Science and / or Mechanical Engineering or an equivalent qualification with sufficient years of experience.

We passionately believe that working at Dialog, you will be joining the brightest, most diverse and ambitious talent in the Semiconductor Industry. We are proud to have won numerous awards and designs, including exclusive patents that have assisted us to years of double-digit growth in this highly competitive industry. With growth planned for 2019, the opportunity for talent to progress at Dialog could not be greater. We are fast becoming the employer of choice within microelectronics chip design, power management solutions, short-range wireless connectivity and AC/DC power conversion.

If you'd like to explore working for Dialog Semiconductor further, then it's time we heard from you. Click below and apply now.

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