Microelectronic Packaging Engineers provide project management, package design/development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units.

• Responsible for the thermal/mechanical/electrical design, analysis, and development of electronic packages.
• Defines overall package performance and specification and realizes technology certification through layout design and test vehicle design.
• Conducts tests and research on basic materials and properties.
• Establishes material specifications for contract assemblers and raw material vendors and interfaces with Quality Assurance and Purchasing regarding material quality and vendor performance.
• Provides consultation concerning packaging problems and improvements in the packaging process. Responds to customer/client requests or events as they occur. Develops solutions to problems utilizing formal education and judgment.

Qualifications

Ability to establishes process specifications for contract assemblers and raw material vendors and interfaces with development partners and QRE in various countries regarding material quality and vendor performance.

• Provides consultation and on-site technical support concerning packaging problems and improvements in the bump and assembly process.
• Requires thorough knowledge and experience of semiconductor packaging industry.
• Provide solutions to a wide range of difficult problems to be occurred during bumping and assembly of packages.
• Assure high volume manufacturing readiness, resources, equipment, process and control, and documentation prior to ramp up after PRQ or package qualification.
• He or she requires thorough knowledge and experience of statistics tool, FA and Rel physics, quality operating system and data analytics.
• Fluent English communication skill in spoken and written is essential.
• Knowledge on key process modules of bumping and assembly and relevant key materials, epoxy, substrate and mold compound, and etc will be advantage.
• Direct hand on experiences and knowledge to bumping and FCBGA,CSP and advanced packages are preferred .
• Others module experiences are good to have. Proven Technical knowledges in package and material characterizations, solving TF issues, exposure to RD activities, proven leadership and integration skills are required.

Minimum Qualifications:

• Qualification is BSc in physics, mechanical, materials, or chemical engineering and sciences with at least 10 years relevant experience.
• MS or PhD are preferred

Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.

Inside this Business Group

Intel's Sales and Marketing (SMG) organization works with global customers and partners to solve critical business problems with Intel based technology solutions. SMG works across business units to amplify the customer voice and deliver solutions that accelerate their business. We work across numerous industries, including retail, enterprise and government, cloud services and healthcare as examples. The operations team focuses on forecasting, driving alignment with factory production and delivering efficiency tools and our marketing capability drives demand and localized marketing in locations around the globe. Our sales force navigates a complex partner and customer ecosystem while shaping product roadmaps, driving value for our customers, and collaborating to harness emerging technology trends to deliver comprehensive solutions.

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site.