The Assembly and Test Technology Development (ATTD) Thermal Core Competency Lab at Intel has an opening for a Packaging R&D Engineer.
Key responsibilities include:
- Performing thermal-mechanical characterizations of Intel packages, developing test plans, and post-processing the collected data.
- Responsible for lab collaterals and tools required for testing units, recording and analyzing thermal-mechanical data, and reporting their findings.
- Work in a team environment and interact with peers and also define and implement lab experiments for feasibility and validation of novel thermal solutions that span from package level innovations to system level engagements.
- Developing novel metrologies and custom data acquisition hardware and software.
Qualifications
Minimum qualifications are required to be initially considered for this position.
Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Minimum Qualifications
- Possess a master's degree or PhD degree would be preferred in Mechanical Engineering or related field.
1+ years of experience with one or more of the following:
- Design of Experiments
- Mechanical Design Tools (e.g. Solidworks)
- Data acquisition hardware and software (e.g. LabVIEW)
- Heat transfer and a basic understanding of statistical analysis (e.g. JMP)
Preferred Qualifications
1+ years of experience with one or more of the following:
- Thermal/mechanical component and system development/validation
- Thermal and fluids analysis software (ANSYS, COMSOL, etc.)
- Project management, particularly in semiconductor packaging
- Machining, electronics, and creating manufacturable designs
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.
Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.
Posting Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Work Model for this Role
This role will require an on-site presence.
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