Support Low Yield Analysis (LYA) for material disposition in the factory within TPT and success rate benchmark. Execute LYA on 24x7 shift operations for Fab, Wafer Level Assembly and Die Prep/ Die Sort factories. Ensure SOP and BKM compliance with DMO LYA VF forums to maintain CE

Qualifications

Chemical/ Materials/ Mechanical Deg/ MastersFA skills/ experience. Analytical/ systematic mindset. Statistical analysis, operational base. Strong problem solving and analytical skills an added advantage.Candidates to execute Physical Failure Analysis for Fab/ Advanced Packaging and DPDS will need to be motivated and willing to learn to drive improvements and velocity in operations.

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.