Intel's recently announced IDM 2.0 strategy includes a plan to significantly expand the manufacturing network, establishing new capacity and capability to meet the accelerating global demand for semiconductors. The Disaggregated Manufacturing Organization (DMO) will play an important role in this strategy, leveraging Intel's Advanced Packaging technology portfolio to deliver leadership products. To enable this ramp, DMO is building an Advanced Packaging manufacturing facility in Malaysia, increasing its investment in this region which has been a critical part of Intel's supply chain for nearly five decades.

Join the Intel Malaysia Advanced Packaging team where you will be instrumental in developing and ramping some of Intel's newest Advanced Packaging technologies and help us realize Intel's vision to create and extend computing technology to connect and enrich the lives of every person on Earth.In this position you will be responsible to improve the process and equipment performance of Die Prep/Test module in our organization.

Your responsibilities will include but not be limited to :

• Continuous improvement to improve Die Prep/Test equipment and process performance to meet Safety Quality Productivity and Cost indicators goal to support Intel products ramp
• Partner with respective Technology Development site and other factories counterpart to develop startup improve and define the critical equipment and process parameters to enable a successful startup and ramp of the factory
• Attend to escalation from Equipment Supervisor Shift MT and troubleshoot the hard down machines from the area where you are assigned to
• Perform detail investigation and problem solving data analysis to ensure equipment tool is up and ready to support production
• Align to product roadmap and build plan requirement proactively work on collaterals ordering and tool fungibility qualification across links to support capacity ramp
• Able to lead and provide coaching and training to sustaining and manufacturing workforce to improve their technical competency
• Able to work independently with minimal supervision and lead a small team of workers to support factory tool and equipment install to meet critical schedule

Qualifications

• Bachelor or Master Degree in Electrical, Electronics, Mechanical Engineering and related Engineering Degree with minimum 5 years working experience.
• Extensive knowledge on tool and equipment installation and qualification for Die Prep tools or equipment will be an added advantage.

Note: This position requires 6-12 months onsite training in Kulim

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

Work Model for this Role

This role will require an on-site presence.