Key Responsibilities

• As a Process Engineer in Memory and Material group of AMAT’s Advanced Product and Technology Development APTD) team your focus will be  process development  for semiconductor memories ( e.g. DRAM, NAND and emerging memories) . You will also be supporting customers high value problems (HVPs) solutions. This requires understanding of basic fab processes, CMOS and memory fabrication steps, electrical performance, and process control mechanisms. Strong communication skill and excellent working habits with cross functional team are must. Successful candidates must be proactive in identifying potential issues and addressing them. Innovations are expected on regular basis.

Key Responsibilities include following but not limited to:

• Position is in Memory and Materials group of APTD, with focus on semiconductor memories /emerging non-volatile memory materials
• Responsible for process integration to develop next generation of memory devices
• Also involves working closely with hardware/process engineering  to develop new chemistry/hardware to improve electrical performance/yield of test chips.
• Provide  the support to AMAT various BUs for developing a solution to customer HVPs in the area of memories and image sensors
• Need to provide guidance for process development to various process modules such etch, photo, MP, etc on regular basis
• Follow through/provide integration support for electrical test lots processed in the AMAT cleanroom.

Background Needed:

• Ph. D.  or Master’s degree in Materials Science, Physics or Electrical Engineering/Micro-electronics or any related field
• Strong background and 3+ years’ experience of process development and or process integration in a wafer fab
• Solid understanding of  unit processes such as Photo, Etch, CMP, Ion Implant, ALD, CVD etc. Hands on experience with any of these will be a strong plus
• Strong understanding of device physics and solid background in material science
• Basic understanding of DRAM, NAND working principals

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