1. Responsible for establishing consistent process across OSATs to ensure good test quality and results (e.g: supply, quality, yield, cycle time).
2. Establish BKM process for wafer sort and final test processes and OSATs proliferation.
3. Creates test hardware checkout criteria and maintenance requirements to OSATs.
- Prober and handler recipe
- Probecard, Loadboard IOQC criteria
- Probecard overdrive, online clean, rebuild criteria and PM rule
- Loadboard, Change-kit and socket PM rule
- Pogo pin lifetime criteria
4. Creates OCAP handling procedure for prober and handler alarms during testing.
5. Responsible for test hardware inventory control, monitoring and purchasing to ensure productive production and HVM sustaining.
6. Responsible for test hardware troubleshooting, debug and repair recommendation to OSATs.
7. Responsible for OSATs and test hardware suppliers scorecard.
8. Drives continuous improvement. E.g: yield, cycle time, cp/cpk, in-line control, oee)
9. Work with Quality to close on any audit findings
Qualifications
1. Bachelor/Master Degree in Electronic Engineering, Mechanical Engineering
2. Minimum 5 years working experience in high volume semiconductor test
3. Strong understanding and experience in wafer sort and final test manufacturing process
4. Experience in probe card and loadboard troubleshooting and repair, socket maintenance.
5. Familiar with prober & handler operation and change-kits design concept will be an advantage
6. Strong analytical and problem-solving skills
7. Proficient in 8D and 5-Why methodology, perform process FMEA, and able to assist in ISO9000 audit
8. Good communication skills and able to interface/communicate effectively with test hardware & ATE suppliers, BUs and OSATs
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.
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