1. Responsible for ensuring the test stability and manufacturability of wafer sort and final test after production ramp.
2. Make significant contributions to wafer sort & final test yield improvement, site-to-site yield gap elimination and yield gap reduction. Evaluation, development and debug of complex test methods.
3. Works with internal cross-function teams, BUs and external manufacturing partners (OSATs) to ensure optimal match of test requirements with production equipment capability with specific emphasis on yield analysis and improvement capability.
4. Responsible for cost-saving and freeing up test capacity through test time reduction and improve test hardware optimizations (e.g: increased parallelism).
5. Works with BUs on test time reduction through identifying no-fail patterns or tests with high volume test data analysis.
6. Drives test platform conversion to support test capacity flexibility
7. Enabling advanced wafer yield analysis through sort program improvements

Qualifications

1. Bachelor/Master Degree in Electronic Engineering or Computer Engineering
2. Minimum 5 years ATE experience or test program development with Advantest V93K, T2K or Teradyne J750/EX ATE platform. Must have the ability to use the debug features along with the ability to understand and modify test code.
3. Familiar with both wafer probers, probe technology, handler, automated thermal control and PCB design along with electric and components is a PLUS.
4. Familiar with SCAN & MBIST pattern debug and digital IC test, debug and development.
5. Strong analytical and problem-solving skills
6. Good communication skills and able to interface/communicate effectively with all levels, BUs and OSATs

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.