Responsible for identifying failures and researching process/Product improvements to enhance yield, performance, quality and reliability of next generation Si, Product and Package technologies.

Investigates and thoroughly explains fundamental aspects of material/device interactions.

Owns the development of electrical, analytical and mechanical methodologies to ensure strategic failure analysis capabilities for future technologies and products.

Directs new technology/product transfer, manufacturing startup, and the automation and improvement of the failure analysis process.

Owns proliferation of shared learning across sites.

Maintains necessary records and reports.

Performs other related duties as required or as directed.

Qualifications

You must possess the below minimum qualifications to be initially considered for this position.

Minimum Qualifications:

You should possess a Bachelor's degree in Electrical Engineering, Computer Engineering, or Computer Science, or related field of study.

Intermediate to Advanced English Level.

2+ years of relevant experience (Experience may be offset by Master or PhD degree).

Preferred Qualifications:

Knowledge in the use of testers (ie. CMT / HDMT).

Understanding of x86 microprocessor architecture, VLSI design, fab process, and device physics.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

Work Model for this Role

This role will require an on-site presence.