In this position, you will be part of the EPG Quality and Reliability group, supporting the qualification for production state of the art high-speed IO interfaces (10 Gb -200 Gb) such as Ethernet devices targeted for the server/cloud and client markets. You will work with the engineers in the group and own specific tasks/projects such device degradation models, stress data analysis and more

Qualifications

- First or second degree electrical /material/ mechanical engineering students (or similar discipline).

- At least 4 semesters left till graduation.

- Availability to work at least 3 full days per week.

- Ability to work in a team, good interpersonal communication.

- An advantage - Knowledge in operating HW , analyzing data (jmp, excel).

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site.